Perforated Plates and Other Porous Media: To Idelchik or not Idelchik
Thursday, May 14, 2015

Electronics assemblies frequently include perforated plates, louvers, fibrous filters, finger guards and other components with very fine flow passages. The primary purpose of each of these parts might serve aesthetic purposes, provide EMI shielding, dust filtering or ensure user safety, but they also can significantly restrict the air flow through the system.

Properly accounting for the added flow resistance they introduce is critical for the thermal design of the electronics. But because these porous media have fine geometric features with small flow passages, it may not be desired — or even feasible — to explicitly simulate the detailed flow passages in a full system-level thermal analysis of the enclosure.

This webcast explores the primary methods of calculating the effects of porous media on the air flow through an electronics system. The methods range from detailed geometric and flow resolution to porous media models to handbook-based calculations. The advantages and disadvantages of each method are examined, and examples show the benefits in time savings and computational efficiencies when the porous resistance approach is appropriately used.

Ruben Bons
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