Automated solution of the inverse problem in electronics cooling
Date: 
Tuesday, February 14, 2017
Description: 

The majority of engineering simulations involve a known geometry, prescribed conditions and computation of the predicted results. However, the design question is often posed as the inverse: I have a desired result and need to know what conditions or what geometry will produce that result. 

For an electronics cooling situation, the inverse problem description might be that you have a targeted maximum temperature for the components and you need to determine what geometry will produce this for a given set of conditions, or alternatively, what are the maximum heat dissipations allowed for a given geometry.

This On-Demand webinar will demonstrate how both ways of posing the inverse electronics cooling problem can be automatically solved using simulation software. A method using the design exploration capabilities will address the variable geometry approach, while a method using field functions will be used to demonstrate the variable conditions situation. 

These techniques will further equip the design engineer in using simulation to design better products, faster.

Industries: 
Speaker: 
Ruben Bons
Patrick McGah
Speaker Company: 
Siemens PLM Software
Products: