CD-adapco and JSOL Sign Collaborative Development Agreement
Printer-friendly versionPDF version

Accelerating the design of next generation electromagnetic devices

New York and London. July 21, 2014

CD-adapco™, the largest privately held CFD focused provider of Computer Aided Engineering software, announced they have signed a collaborative development agreement with JSOL, the authors of the JMAG electromagnetics code, to jointly develop co-simulation methods in the domain to coupled thermal & electromagnetic simulations.

Jean-Claude Ercolanelli, CD-adapco Senior Vice President Product Management, comments, “Enabling the co-simulation of both thermal and electromagnet phenomena using best-in-class tools will allow users to truly optimise product designs.” Moreover he added, “This collaboration builds on the existing relationship and data transfer methods already being used between our flagship product, STAR-CCM+®, and JSOL’s JMAG code”

"We are very pleased to be partnering with CD-adapco and to introduce co-simulation methods between these best-in-class technologies," said Takashi Yamada, Ph.D., Manager of the Electromagnetic Engineering Group at JSOL. "We hope that together we can provide smooth and reliable multi-physics/multi-disciplinary simulations with STAR-CCM+ and JMAG for that will benefit  our joint customers."

The partnership was forged during 2013 when establishing a data transfer process between the two companies’ simulation codes, passing electromagnetic loss distributions and component temperature distributions. The collaborative agreement builds on this existing process and will allow a tighter coupling to be achieved. The performance of components within the majority of electromagnetic devices are temperature dependant therefore finding the final 5% of an optimum design requires the co-simulation of such processes. Doing so within a productive environment will unleash the final 5% to product designers. A first release is expected in 2015 and example problems are now being trialled.

For more information please visit or