Best Practices Overview for Electronics Thermal Simulations

Printer-friendly versionPDF version

The most common simulation for electronics products involves predicting the system temperature under the chosen cooling methodology.  

This presentation will overview the primary best practices for thermal simulation of electronics models. Specific techniques in STAR-CCM+ will be addressed covering the entire CAD-to-results process including geometry preparation, meshing, physics setup, conditions, and solution settings on models with hundreds of components.

Both forced and natural cooling simulations involving conduction, convection, and radiation will be examined in the detailed tips and links to additional information.

Author Company: 
Author Name: 
Ruben Bons